Copper (Cu) Sputtering Targets (4” × 0.125”)
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.99% |
| Size | 4” |
| Thickness | 0.125” |
| Process Overview | Sputtering deposits thin films from a variety of materials onto diverse substrate shapes and sizes. The process is repeatable, scalable from R&D to production batches for medium to large substrates. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters. Sputtering allows precise control over growth and microstructure. |
| Applications | – Thin film deposition by eroding material from a target onto a substrate (e.g., silicon wafer). – Semiconductor etching requiring high anisotropy. – Analytical applications like SIMS for composition measurement and impurity detection. – Space applications: space weathering affecting physical and chemical properties of airless bodies such as asteroids and the Moon. |
