Copper (Cu) Sputtering Targets
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 4” |
| Thickness | 0.125” |
| Process Overview | Sputtering deposits thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process is repeatable, scalable from R&D to production batches for medium to large substrates. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters. The many parameters make sputter deposition complex but allow precise control over growth and microstructure. |
| Applications of Sputtering Targets | Used for thin film deposition by eroding material from a “target” onto a “substrate” such as silicon wafers. Also used in semiconductor etching when high anisotropy is required, and for analysis like SIMS, where sputtered atoms are measured to determine composition and detect trace impurities. Applied in space weathering, affecting the physical and chemical properties of airless bodies such as asteroids and the Moon. |
