| Applications |
Sputtering targets are used for film deposition. The deposition achieved by sputter targets is a method of depositing thin films by sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used to etch the target. Sputter etching is selected in cases where a high degree of etching anisotropy is required and selectivity is not a concern. Sputter targets are also used for analysis by etching away the target material. One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. Using the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected. Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon. Carbon nanotubes doped with metallic nanopowders provide significant enhancements in both electrical and mechanical performance. These improvements include increased hardness, tensile strength, specific strength, and elastic modulus. Some of these applications include: 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates. |
