Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets
| Property | Specification |
|---|---|
| Purity | 99.9% |
| Size | 6” |
| Thickness | 0.250” |
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process with sputter targets is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although sputter deposition involves many variables, these parameters provide experts with precise control over the growth and microstructure of the deposited area.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This method involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching purposes. Sputter etching is selected in cases where a high degree of etching anisotropy is needed and selectivity is not a critical factor.
Sputter targets are also applied in analytical techniques by etching away the target material. For example, in secondary ion mass spectrometry (SIMS), the target sample is sputtered at a constant rate. As the target is eroded, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material can be determined, including extremely low concentrations of impurities.
Sputtering targets also have applications in space science. Sputtering represents a form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
