Lanthanum Manganate (LaMnO₃) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 2” |
| Thickness | 0.250” |
Overview
Sputtering is a reliable and widely used technique for depositing thin films on various substrate types and geometries. The process is highly repeatable, scalable from R&D to larger production batches, and adaptable to medium-to-large substrate areas. Depending on process conditions, chemical reactions may occur on the target surface, during particle transport, or at the substrate. Although sputtering involves numerous parameters, this complexity enables precise control over thin-film growth and microstructure.
Applications
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Thin-Film Deposition: Transfers material from a target to substrates such as silicon wafers through controlled erosion and deposition.
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Semiconductor Processing: Used for sputter etching where high anisotropy is required and selectivity is not a primary concern.
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Material Characterization: Essential in SIMS, where continuous sputtering enables measurement of elemental composition and trace impurities via mass spectrometry.
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Space Science: Contributes to space weathering, which alters the physical and chemical characteristics of airless bodies like the Moon and asteroids.
