Lanthanum Manganate (LaMnO3) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO3) Sputtering Targets |
| Purity | 99.9% |
| Size | 4” |
| Thickness | 0.250” |
Overview
Sputtering is a well-established technique for depositing thin films from a variety of materials onto diverse substrate shapes and sizes. The process with sputtering targets is repeatable and scalable from small research projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. While sputter deposition involves many variables, it allows experts precise control over film growth and microstructure.
Applications
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Thin-Film Deposition: Material is eroded from a “target” source and deposited onto a “substrate,” such as silicon wafers.
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Semiconductor Etching: Sputter etching is used when high anisotropy is required and selectivity is less critical.
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Analytical Techniques: Targets are etched for analysis, such as in secondary ion mass spectrometry (SIMS), enabling detection of low concentrations of impurities.
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Space Applications: Sputtering contributes to space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
