Copper (Cu) Nanopowder/Nanoparticles
Purity: 99.85%, Size: 22 nm, Partially Passivated
Technical Properties:
| Property | Value |
|---|---|
| Cu Purity (%) | ≥99,8 (partially passivated by coating nanoparticles with 0,8 wt% oxygen for safe shipping) |
| Bulk Density (g/cm3) | 0,2–0,4 |
| True Density (g/cm3) | 8,9 |
| Color | dark brown |
| Shape | spherical |
| Crystal Structure | cubic |
| Average Particle Size (nm) | 22 |
| Specific Surface Area (m2/g) | 35,0–55,0 |
Elemental Analysis:
| Element | Cu | Si | Others |
|---|---|---|---|
| Value | ≥99.8 | 0.1 | ≤0.01 |
Properties, Storage and Cautions:
Copper nanoparticles are highly reactive and flammable, so they must be handled with care. Rapid movements and vibrations should be avoided. The nanopowder must be kept away from sunlight, heat, moisture, and physical impacts. Because particle coagulation is a serious issue, the material should be sealed under vacuum and stored in cool, dry conditions. Air exposure should be avoided.
Applications:
Copper nanoparticles are well known for their high electrical conductivity and are widely used in the electronics industry. They are suitable for conducting coatings, inks, and pastes; raw materials for electronic components; catalysts for reactions such as methanol production; microelectronic devices; lubricant additives; wear-resistant coatings; and sintering additives.
